We need to “hack” our machines to speed up the fabrication process of Hardsploit electronic boards :
That was the duration to produce one board:
- 5 mn to place the stencil above the electronic board
- 14 mn by board for the pick & place (component positioning)
- 10 mn of soldering in the oven
- +1 hour of debugging electronic boards (due to soldering issues)
We decided to make some improvements : Stencil Dispenser Hacking (physically) !
- A / Order a larger stencil with smaller holes the goal is to position it in a more precise manner above the board (solder past dispensing improvement !)
- B / Add two specifics High Tech wood buttons (;-)) with screws to increase the tension of the stencil to improve solder paste dispensing (stencil positioning improvement !)
- C/ Tweak some speed parameters in our M10 pick & Place machine to speed up the process (component placement speed improvement!)
RESULTS :
- 30s to place the stencil above the electronic board
- 7 mn by boards for the pick & place
- 10 mn soldering in reflow oven
- No more or few short circuits issues to debug
Half of afternoon production batch finished, we succeed to improve our process :
Work continue ! (we have 60 more Hardsploit to finish 😉 )
Leave a Reply
You must be logged in to post a comment.